wbbgalga(hs)pbgab series-开元体育


wbbgalga(hs)pbgab series

分类: wbbgawblga series
wbbgalga(hs)pbgab series

wbbga/lga/(hs)pbga technology


technology overview

tfme’s bga (ball grid array) is a laminated substrate packaging solution that is compatible with various smt surface mount processes in the industry. full-size fine pitch bga (fbga) is suitable for different package sizes(0.8 to 25mm), thicknesses(0.5 to 1.6mm), a broad range of ball grid array pitch (≥ 0.35 mm pitch), different number of balls for the single and multi-die layouts, stacked dies (1-16) and passive component integration designs. thin core laminate (1 to 8 metal layers) from the strong supply chain in the industry, ultra-thin mold cap thicknesses and silicon wafer thinning to 50 µm enable next-generation tablets, smartphones, game controllers, automotive, industrial, digital and video cameras and remote devices.


tfme also provides a variety of mature lga (land grid array) solutions. tfme’s lga is suitable for different package size (0.7 to 15mm including the special package), thickness (0.4 to 1.4mm), and standard terminal (≥ 0.4mm pitch), core and coreless processes that could offer the service from prototype design to application of rf, wi-fi, bluetooth, iot, fingerprint sensor, rfid, navigation and other products.


 ◆ leading edge technology and expanding package offerings provide a platform from prototype-to-production;

 ◆ 0.7-27mm package size available, including (hs)pbga 23x23mm & 27x27mm;

 ◆ 8-1000 ball/lead counts;

 ◆ 0.35, 0.4, 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball pitch available;

 ◆ suitable substrate for multi-die (mcm and stack) and integrated smt structures;

 ◆ outstanding flexible internal routing of signal, power, and ground for device performance and system compatibility;

 ◆ rohs-6 (green) bom options for 100% of product family

 ◆ gold, coper, and silver wire interconnection method and high-volume infrastructure at tfme production facilities;

 ◆ thermal conductivity epoxy (3&6w/mk) and high thermal conductivity silver paste (100w/mk) available

 ◆ excellent reliability and low-cost production solutions;

 ◆ jedec publication 95 design guide 4.5 (jep95);


 tfme的bga(ball grid array)是一种层压基板封装开元体育的解决方案,兼容行业各种smt表面贴装制程。全尺寸小节距 bga (fbga)适用于不同封装尺寸(0.8至25mm)、厚度(0.5至1.6mm)、各种球栅阵列节距(≥ 0.35 mm节距)、不同焊球数量、单晶片多晶片布局、堆叠晶片(1-16) 和被动元件集成等设计。行业供应链提供的薄型核心层压基板(1至8个金属层)、超薄塑封体厚度和薄至 50 微米硅晶圆,为打造下一代平板电脑、智能手机、游戏控制器、汽车、工业、数字和视频摄像头和远程设备提供开元体育的解决方案。

 同时tfme提供各种成熟的系统集成lga(land grid array)方案:封装尺寸0.7至15mm(含异形封装)、厚度0.4至1.4mm、标准端子节距0.4mm以上、core和coreless工艺制程,为射频、wi-fi、蓝牙、iot、指纹识别、电子标签、定位导航等产品从设计到应用的全流程服务。


 ◆ 尖端技术和大量封装开元体育的解决方案提供原型到生产的平台

 ◆ 支持 0.7-27 mm封装尺寸, 包含(hs)pbga23x23、27x27

 ◆ 8-1000个焊球/引脚数量

 ◆ 支持 0.35、0.4、0.5、0.65、0.75、0.80 & 1.0 mm焊球节距

 ◆ 适用于多晶粒 (mcm、stack) 和集成 smt 结构的基板类封装

 ◆ 高度灵活的内部信号、电源和接地布线,提升器件性能和系统兼容性

 ◆ 全部采用 rohs-6(绿色)材料

 ◆ 采用金线、铜线、银线互连方式,并且都设有大批量生产设施

 ◆ 支持热传导环氧基树脂 (3w&6w/mk) 和高导热银浆 (100w/mk)

 ◆ 高可靠性和低成本开元体育的解决方案

 ◆ jedec publication 95 design guide 4.5 (jep95)






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