fo series-开元体育

产品技术

fo series

分类: fo series
fo series
技术介绍

fo technology

fo series

technology overview

we offer both chip first and chip last solutions. for chip first technology,first step is place die face down on the temporary carrier with adhesion layer. the second step is to cover the die surface by molding compound (emc). the third step is to remove the adhesion layer and the temporary carrier through thermal release; finally, rdl layer and solder ball are directly made on die& compound surface.

fan out can use not only compound materials, but also substrates, thus expanding the fan out package to another type: fan out package on substrate (fopos).

applications

we will optimize our solutions to meet customer requirements. fo technologies are used in mic, rf, cpu, gpu and network.

features

 ◆ fo size: 32x26mm

 ◆ advance nodes to 16 nm

 ◆ rdl l/s: 2/2um

 ◆ rdl layer: 3 layers

package types

 ◆ ewlb

 ◆ fopos-chip first face down

 ◆ fopos-chip first face up

 ◆ fopos-chip last

key advantages include

 ◆ low cost than 2.5d

 ◆ good electrical performance

 ◆ high i/o pin counts

we also offer extensive test developments for products and are experienced in cpu, apu, gpu, chipset, digital audio, baseband, microcontroller, lcd driver, touch panel driver.

上一个
下一个
通富微
二维码

通富微电子股份有限公司

地址:中国江苏省南通市崇川路288号

邮编:226004

email:

ky开元官网版2023下载 copyright © 2022 通富微电子股份有限公司 ky开元官网版2023下载的版权所有.       seo标签

网站地图